Velodyne Lidar, Inc. introduced its intelligent and effective auto -sensing solutions for autonomous vehicles (AVs) and advanced driver assistance systems (Advanced Driver Assistance Systems, ADAS) at the Automated Vehicle Symposium, July 15-18 in Orlando.
The Velodyne booth will feature the Velodyne Alpha Puck, a handle sensor specifically produced for standalone driving and advanced vehicle safety at road speeds, and the Velodyne Velarray directional view , a vital component of ADAS. Velodyne’s handle sensors will showcase its combination of long-range, high-resolution and field-wide field-wide vision. Velodyne is a large-volume supplier of automotive sensor sensors, with more than 250 customers globally.
In a symposium session, Vidya Devarasetty, global manager of automotive sales and business development for Velodyne Lidar, will give a presentation on “High-Definition 3D Lidar Sensors: A Vital Part of the Autonomous Driving of the Future.” The session will provide an overview of how the handle sensors used for the specific task of autonomous driving, including use cases that have proven difficult for camera-based and radar solutions. It will include an overview of the marketplace where technology is currently positioned and provide insight into what to expect from the next generation of high-definition sensor handling.
“More than 90% of accidents are caused by human errors, according to US government data. These accidents can be avoided if vehicles are equipped with front-facing sensors that provide accurate measurements of objects on the road at all times. weather conditions, “Devarasetty said.
In another symposium session, Frank Bertini, UAV and Robotics business manager for Velodyne Lidar, will give a presentation on the “State of Solid State 3D Lode Sensor”. The technical presentation will discuss how Velodyne’s application-specific integrated microchips (ASIC) application-specific integrated microchips have provided an advance in 3D sensor handling design.
“The main electronic sensor sensors are moving from printed circuit board to ASIC, which offers advantages such as higher density, lower cost and greater reliability. The trend follows Moore’s Law, leading to dramatic decreases in size, weight and cost in periods relatively short time, “Bertini said.